Employee Retention of Amkor Technology : Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor announced on June 3, 2005, that it had moved to Chandler, Arizona.[4] The company has 20,033 employees worldwide and had $1.9 billion in sales in 2004.
With the majority of its factories in China, Japan, Korea, Philippines, Singapore, Taiwan, and the United States, Amkor is a leading player in the semiconductor industry. It packages and tests integrated circuits (ICs) for chip manufacturers. One of Amkor's product developments is its MicroLeadFrame chip carrier (IC package) technology.
Amkor is one of the world's largest subcontractors of semiconductor
packaging and test services. Amkor pioneered the outsourcing of semiconductor
assembly and test services in 1968, and over the years has built a leading
position by:
- Providing a broad portfolio of packaging and test technologies and
services;
- Maintaining a leading role in the design and development of new package and
test technologies;
- Cultivating long-standing relationships with customers, including many of
the world's leading semiconductor companies;
- Developing expertise in high-volume manufacturing; and
- Diversifying our operational scope by providing production capabilities in
China, Japan and Taiwan, in addition to long-standing capabilities in Korea
and the Philippines.
SUBCONTRACT PROVIDERS CAN OFFER SHORTER TIME TO MARKET FOR NEW PRODUCTS
BECAUSE THEIR RESOURCES ARE DEDICATED TO PACKAGING AND TEST SOLUTIONS.
We believe that semiconductor companies are seeking to shorten the time to
market for their new products, and that having the right packaging technology
and capacity in place is a critical factor in facilitating product
introductions.
Semiconductor companies frequently do not have sufficient time to develop
their packaging and test capabilities or the equipment and expertise to
implement new packaging technology in volume. For this reason, semiconductor
companies are leveraging the resources and capabilities of subcontract packaging
and test companies to deliver their new products to market more quickly.
MANY SEMICONDUCTOR MANUFACTURERS DO NOT HAVE THE ECONOMIES OF SCALE TO OFFSET
THE SIGNIFICANT COSTS OF BUILDING PACKAGING AND TEST FACTORIES.
Semiconductor packaging is a complex process requiring substantial
investment in specialized equipment and factories. As a result of the large
capital investment required, this manufacturing equipment must operate at a high
capacity level for an extended period of time to be cost effective. Shorter
product life cycles, faster introductions of new products and the need to update
or replace packaging equipment to accommodate new package types have made it
more difficult for semiconductor companies to maintain cost effective
utilization of their packaging and test assets. Subcontract providers of
packaging and test services, on the other hand, can use their equipment to
support a broad range of customers, potentially generating greater manufacturing
economies of scale.
THE AVAILABILITY OF HIGH QUALITY PACKAGING AND TESTING FROM SUBCONTRACTORS
ALLOWS SEMICONDUCTOR MANUFACTURERS TO FOCUS THEIR RESOURCES ON SEMICONDUCTOR
DESIGN AND WAFER FABRICATION.
LEADING TECHNOLOGY INNOVATOR
We believe that we are one of the leading providers of advanced
semiconductor packaging and test solutions. We have designed and developed
several state-of-the-art leadframe and laminate package formats including our
MicroLeadFrame(R), VisionPak(TM), PowerQuad(R), SuperBGA(R), fleXBGA(R) and
ChipArray(R) BGA packages. To maintain our leading industry position, we have
more than 300 employees engaged in research and development focusing on the
design and development of new semiconductor packaging and test technology. We
work closely with customers and technology partners to develop new and
innovative package designs.
We're looking for dynamic professionals who blend creativity and experience with vision and cooperation. Our unique corporate culture is reflected in our main purpose: use our collective talents and energies to achieve prosperity and fulfillment for our customers, our company and our people.
Amkor Technology's mission is to be the world's premier Semiconductor Assembly and Test Services company through customer satisfaction, leading edge technology and financial performance.
With the majority of its factories in China, Japan, Korea, Philippines, Singapore, Taiwan, and the United States, Amkor is a leading player in the semiconductor industry. It packages and tests integrated circuits (ICs) for chip manufacturers. One of Amkor's product developments is its MicroLeadFrame chip carrier (IC package) technology.
Amkor is one of the world's largest subcontractors of semiconductor
packaging and test services. Amkor pioneered the outsourcing of semiconductor
assembly and test services in 1968, and over the years has built a leading
position by:
- Providing a broad portfolio of packaging and test technologies and
services;
- Maintaining a leading role in the design and development of new package and
test technologies;
- Cultivating long-standing relationships with customers, including many of
the world's leading semiconductor companies;
- Developing expertise in high-volume manufacturing; and
- Diversifying our operational scope by providing production capabilities in
China, Japan and Taiwan, in addition to long-standing capabilities in Korea
and the Philippines.
SUBCONTRACT PROVIDERS CAN OFFER SHORTER TIME TO MARKET FOR NEW PRODUCTS
BECAUSE THEIR RESOURCES ARE DEDICATED TO PACKAGING AND TEST SOLUTIONS.
We believe that semiconductor companies are seeking to shorten the time to
market for their new products, and that having the right packaging technology
and capacity in place is a critical factor in facilitating product
introductions.
Semiconductor companies frequently do not have sufficient time to develop
their packaging and test capabilities or the equipment and expertise to
implement new packaging technology in volume. For this reason, semiconductor
companies are leveraging the resources and capabilities of subcontract packaging
and test companies to deliver their new products to market more quickly.
MANY SEMICONDUCTOR MANUFACTURERS DO NOT HAVE THE ECONOMIES OF SCALE TO OFFSET
THE SIGNIFICANT COSTS OF BUILDING PACKAGING AND TEST FACTORIES.
Semiconductor packaging is a complex process requiring substantial
investment in specialized equipment and factories. As a result of the large
capital investment required, this manufacturing equipment must operate at a high
capacity level for an extended period of time to be cost effective. Shorter
product life cycles, faster introductions of new products and the need to update
or replace packaging equipment to accommodate new package types have made it
more difficult for semiconductor companies to maintain cost effective
utilization of their packaging and test assets. Subcontract providers of
packaging and test services, on the other hand, can use their equipment to
support a broad range of customers, potentially generating greater manufacturing
economies of scale.
THE AVAILABILITY OF HIGH QUALITY PACKAGING AND TESTING FROM SUBCONTRACTORS
ALLOWS SEMICONDUCTOR MANUFACTURERS TO FOCUS THEIR RESOURCES ON SEMICONDUCTOR
DESIGN AND WAFER FABRICATION.
LEADING TECHNOLOGY INNOVATOR
We believe that we are one of the leading providers of advanced
semiconductor packaging and test solutions. We have designed and developed
several state-of-the-art leadframe and laminate package formats including our
MicroLeadFrame(R), VisionPak(TM), PowerQuad(R), SuperBGA(R), fleXBGA(R) and
ChipArray(R) BGA packages. To maintain our leading industry position, we have
more than 300 employees engaged in research and development focusing on the
design and development of new semiconductor packaging and test technology. We
work closely with customers and technology partners to develop new and
innovative package designs.
We're looking for dynamic professionals who blend creativity and experience with vision and cooperation. Our unique corporate culture is reflected in our main purpose: use our collective talents and energies to achieve prosperity and fulfillment for our customers, our company and our people.
Amkor Technology's mission is to be the world's premier Semiconductor Assembly and Test Services company through customer satisfaction, leading edge technology and financial performance.
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