netrashetty
Netra Shetty
Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor announced on June 3, 2005, that it had moved to Chandler, Arizona.[4] The company has 20,033 employees worldwide and had $1.9 billion in sales in 2004.
With the majority of its factories in China, Japan, Korea, Philippines, Singapore, Taiwan, and the United States, Amkor is a leading player in the semiconductor industry. It packages and tests integrated circuits (ICs) for chip manufacturers. One of Amkor's product developments is its MicroLeadFrame chip carrier (IC package) technology.
Advances in IC packaging are being driven by semiconductor technology and the explosion in the wireless and internet markets. Amkor is an industry leader in finding IC packaging solutions to meet these complex requirements.
To serve the diverse needs of more than 200+ world class semiconductor manufacturers, Amkor offers more than 850+ different package formats and sizes, from traditional leadframe IC packages for through-hole and surface mounting, all the way to the latest chip scale and ball grid array solutions required in high pin count and high density applications such as Stacked Die Packaging, Wafer Level Packaging, MEMS Packaging and 3D Packaging. This broad product family allows Amkor to be a single source for many of its customers' total IC packaging requirements from legacy devices to tomorrow's System in Package solutions.
We also offer other package types such as: BCC, BQFP, BOC, CCD II, CCD III, Ceramic Packages, DIC, DIP, DLP, ezBGA, FQFP, Flip Stack, Hermetics, HYBRID, J-Lead, LCPGA, LDCC, LLCC, LTCC, M2BGA, M2CSP, MCSP, MDIP, Memory CSP, Micro EMS, PLGA, PQFP, QFJ, SMD Modules, SnapArray, SOP, SZIP, TAPP™, TBGA, ViperBGA, VBGA, Wafer Backgrind, Wafer Saw, ZIP.
Featured Products
Fine Pitch Copper Pillar Flip Chip
Copper pillar bump is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future ROHS requirements. It is an excellent interconnect choice for applications where some combination of fine pitch, ROHS / Green compliance, low cost and electromigration performance are required.
3D & Stacked-Die Packaging Technology Solutions
Amkor Technology's commitment to provide high volume, low cost 3d packaging has led to the production of smaller, thinner packages.
MEMS / MOEMS Packaging Technology Solutions
Amkor Technology is the world's leader in MEMS / MOEMs (Micro Electronic Packaging technologies) and the world's largest outsource provider of Micro-Electronic Machines (MEMS).
Flip Chip Packaging Technology Solutions
Demand for flip chip technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. SuperFC®, fcBGA, fcLBGA and fcCSP are qualified and are in production.
FlipStack® CSP
The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost.
FCmBGA (Flip Chip Molded Ball Grid Array)
FCmBGA provides additional benefits such as improved board real estate use, by allowing closer spacing between passives and the flip chip die, better warpage control for thin core substrates and improved solder joint reliability for passives.
fcCSP (Flip Chip CSP)
Amkor Technology is now offering the Flip Chip CSP (fcCSP) package -- a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wire-bond interconnect.
Package on Package (PoP | PSfvBGA | PSfcCSP | TMV® PoP)
Amkor has expanded its comprehensive PoP (Package on Package) family and aligned the roadmap across the supply chain to ensure that PoP will continue to scale with the industry's miniaturization, higher density and performance enhancement requirements.
CSPnl - Wafer Level Packaging (DSBGA | WLCSP | WCSP | WLP)
CSPnl is a true wafer level package that can incorporate thin film redistribution films to route I/O pads to JEDEC / EIAJ standard pitches, and thereby, avoiding the need to redesign legacy parts for CSP applications.
Amkor Technology is a leading provider of semiconductor assembly and test services to semiconductor companies and electronics OEMs. Amkor offers more than 850+ different IC package formats and sizes, from traditional leadframe packages for through-hole and surface mounting, all the way to the latest chip scale (CSP) and ball grid array (BGA) solutions. The following is a complete list of our semiconductor packaging solutions in alphabetical order.
3D & Stacked-Die Packaging Technology Solutions
Amkor Technology's commitment to provide high volume, low cost 3d packaging has led to the production of smaller, thinner packages.
ChipArray® BGA | Thin ChipArray® | Very Thin ChipArray®
Amkor’s ChipArray® packages (CABGA, CVBGA, CTBGA) are laminate based Ball Grid Array (BGA) packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count, and body sizes.
CASON® (ChipArray SON)
Amkor's ChipArray CASON packages are laminate-based products available as QFN / QFP (Quad Flat No-Lead) packages.
CSPnl - Wafer Level Packaging (DSBGA | WLCSP | WCSP | WLP)
CSPnl is a true wafer level package that can incorporate thin film redistribution films to route I/O pads to JEDEC / EIAJ standard pitches, and thereby, avoiding the need to redesign legacy parts for CSP applications.
ExposedPad LQFP / TQFP
This Amkor developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages.
ExposedPad SOIC / SSOP
This Amkor developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC and SSOP packages.
ExposedPad TSSOP
This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard TSSOP packages.
fcCSP (Flip Chip CSP)
Amkor Technology is now offering the Flip Chip CSP (fcCSP) package -- a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wire-bond interconnect.
FCmBGA (Flip Chip Molded Ball Grid Array)
FCmBGA provides additional benefits such as improved board real estate use, by allowing closer spacing between passives and the flip chip die, better warpage control for thin core substrates and improved solder joint reliability for passives.
Fine Pitch Copper Pillar Flip Chip
Copper pillar bump is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future ROHS requirements. It is an excellent interconnect choice for applications where some combination of fine pitch, ROHS / Green compliance, low cost and electromigration performance are required.
Flip Chip Packaging Technology Solutions
Demand for flip chip technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. SuperFC®, fcBGA, fcLBGA and fcCSP are qualified and are in production.
FlipStack® CSP
The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost.
FusionQuad® (VQFP / HVF-PQFP)
Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad QFP and MLF® technologies. FusionQuad® is based upon the addition of exposed bottom lands within a standard VQFP package format.
LQFP (Low Profile QFP)
Amkor offers a broad line of LQFP (QFP) IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness.
MCM-PBGA | MCM-BGA (Multi-Chip Module Plastic Ball Grid Array)
The MCM-PBGA (Multi-Chip Module Plastic Ball Grid Array) by Amkor incorporates the latest technology in high-density plastic IC packaging.
MEMS / MOEMS Packaging Technology Solutions
Amkor Technology is the world's leader in MEMS / MOEMs (Micro Electronic Packaging technologies) and the world's largest outsource provider of Micro-Electronic Machines (MEMS).
MicroLeadFrame® (MLF / QFN - Quad Flat No-Lead)
Amkor's MicroLeadFrame® (MLF / QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB.
MQFP (Metric QFP Package)
Amkor’s MQFP (Metric QFP) package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material and processes to assure successful, reliable performance of your IC chips. Having a complete line of MQFPs available and at your disposal means security, convenience and success.
MQFP PowerQuad 4
Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to solve these thermal problems.
Multi-Chip Package (MCP) | Stacked-Die Leadframe Package
Amkor's multi-chip package (MCP) and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor.
PBGA (Plastic Ball Grid Array)
Amkor's PBGAs (Plastic BGA) incorporate the most advanced assembly processes and designs for today's and tomorrow's cost / performance applications.
PDIP (Plastic Dual Inline Package) | SPDIP | DIP
Amkor is committed to continuing to service this long established standard industry package. The Amkor PDIP comes in a wide range of lead counts: from 8 - 48 leads with a lead pitch of 100 mils.
PLCC (Plastic Leaded Chip Carrier) | LCC Package
Amkor's PLCC offerings cover the total range offered by the industry. It includes all square body packages from 20 lead through 84 lead. Also included is the rectangular body format of the 32 lead. RoHs compliant, lead-free & green material sets are now our qualified standards.
PSOP (PowerSOP® 2 & 3 / PSSOP Package)
The Amkor-developed family of power IC PSOP (PowerSOP) packages significantly increases the thermal efficiency of power constrained standard SOIC packages.
Package on Package (PoP | PSfvBGA | PSfcCSP | TMV® PoP)
Amkor has expanded its comprehensive PoP (Package on Package) family and aligned the roadmap across the supply chain to ensure that PoP will continue to scale with the industry's miniaturization, higher density and performance enhancement requirements.
SOIC (Small Outline IC) Package
Amkor has a broad portfolio of Small Outline ICs (SOIC) packages, including .150”, .208” and .300” body sizes.
SOT-23 (Standard Outline Transistor) | SC-70 (Single Chip)
Amkor’s 1.0 mm thick, 3, 5, 6, and 8 lead SOT23 and 5 and 6 lead SC70 packages offer gullwing lead, sub-miniature, SMT performance characteristics.
SSOP (Shrink Small Outline Package) | MSOP (Micro SOP)
How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them. Shrink small-outline package (SSOP) is a microchip package for SMT and have "gull wing" leads protruding from the two long sides.
Stacked CSP (SCSP)
The Stacked CSP (SCSP) family utilizes Amkor's industry leading ChipArray® manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements.
SuperBGA®
The SuperBGA® (SBGA) technology provides a cavity down, high-power BGA package. SuperBGA®'s utilize advanced substrate designs with proven assembly practices and materials to assure your IC complementary performance.
SuperFC® (Super Flip Chip | FCBGA | Flip Chip BGA)
Amkor's SuperFC® (Flip Chip BGA) is the high performance flip chip solution. Flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding.
System in Package (SiP)
Amkor Technology is committed to being a leader in providing the services necessary to make our customers successful with System in Package technologies.
TEPBGA (Thermally Enhanced PBGA)
This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors (silicon).
TQFP
Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.
tsCSP (Thin Substrate CSP)
Amkor's tsCSP is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard outlines of the tsCSP package offer a broad selection of land pitch, count, and body sizes.
TSOP / WSOP
Amkor offers a full family of popular TSOP packages to serve the needs of IC designers, PCB / system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate reliably in a variety of environments.
TSSOP (Thin Shrink Small Outline Package)
With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin!
With the majority of its factories in China, Japan, Korea, Philippines, Singapore, Taiwan, and the United States, Amkor is a leading player in the semiconductor industry. It packages and tests integrated circuits (ICs) for chip manufacturers. One of Amkor's product developments is its MicroLeadFrame chip carrier (IC package) technology.
Advances in IC packaging are being driven by semiconductor technology and the explosion in the wireless and internet markets. Amkor is an industry leader in finding IC packaging solutions to meet these complex requirements.
To serve the diverse needs of more than 200+ world class semiconductor manufacturers, Amkor offers more than 850+ different package formats and sizes, from traditional leadframe IC packages for through-hole and surface mounting, all the way to the latest chip scale and ball grid array solutions required in high pin count and high density applications such as Stacked Die Packaging, Wafer Level Packaging, MEMS Packaging and 3D Packaging. This broad product family allows Amkor to be a single source for many of its customers' total IC packaging requirements from legacy devices to tomorrow's System in Package solutions.
We also offer other package types such as: BCC, BQFP, BOC, CCD II, CCD III, Ceramic Packages, DIC, DIP, DLP, ezBGA, FQFP, Flip Stack, Hermetics, HYBRID, J-Lead, LCPGA, LDCC, LLCC, LTCC, M2BGA, M2CSP, MCSP, MDIP, Memory CSP, Micro EMS, PLGA, PQFP, QFJ, SMD Modules, SnapArray, SOP, SZIP, TAPP™, TBGA, ViperBGA, VBGA, Wafer Backgrind, Wafer Saw, ZIP.
Featured Products
Fine Pitch Copper Pillar Flip Chip
Copper pillar bump is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future ROHS requirements. It is an excellent interconnect choice for applications where some combination of fine pitch, ROHS / Green compliance, low cost and electromigration performance are required.
3D & Stacked-Die Packaging Technology Solutions
Amkor Technology's commitment to provide high volume, low cost 3d packaging has led to the production of smaller, thinner packages.
MEMS / MOEMS Packaging Technology Solutions
Amkor Technology is the world's leader in MEMS / MOEMs (Micro Electronic Packaging technologies) and the world's largest outsource provider of Micro-Electronic Machines (MEMS).
Flip Chip Packaging Technology Solutions
Demand for flip chip technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. SuperFC®, fcBGA, fcLBGA and fcCSP are qualified and are in production.
FlipStack® CSP
The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost.
FCmBGA (Flip Chip Molded Ball Grid Array)
FCmBGA provides additional benefits such as improved board real estate use, by allowing closer spacing between passives and the flip chip die, better warpage control for thin core substrates and improved solder joint reliability for passives.
fcCSP (Flip Chip CSP)
Amkor Technology is now offering the Flip Chip CSP (fcCSP) package -- a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wire-bond interconnect.
Package on Package (PoP | PSfvBGA | PSfcCSP | TMV® PoP)
Amkor has expanded its comprehensive PoP (Package on Package) family and aligned the roadmap across the supply chain to ensure that PoP will continue to scale with the industry's miniaturization, higher density and performance enhancement requirements.
CSPnl - Wafer Level Packaging (DSBGA | WLCSP | WCSP | WLP)
CSPnl is a true wafer level package that can incorporate thin film redistribution films to route I/O pads to JEDEC / EIAJ standard pitches, and thereby, avoiding the need to redesign legacy parts for CSP applications.
Amkor Technology is a leading provider of semiconductor assembly and test services to semiconductor companies and electronics OEMs. Amkor offers more than 850+ different IC package formats and sizes, from traditional leadframe packages for through-hole and surface mounting, all the way to the latest chip scale (CSP) and ball grid array (BGA) solutions. The following is a complete list of our semiconductor packaging solutions in alphabetical order.
3D & Stacked-Die Packaging Technology Solutions
Amkor Technology's commitment to provide high volume, low cost 3d packaging has led to the production of smaller, thinner packages.
ChipArray® BGA | Thin ChipArray® | Very Thin ChipArray®
Amkor’s ChipArray® packages (CABGA, CVBGA, CTBGA) are laminate based Ball Grid Array (BGA) packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count, and body sizes.
CASON® (ChipArray SON)
Amkor's ChipArray CASON packages are laminate-based products available as QFN / QFP (Quad Flat No-Lead) packages.
CSPnl - Wafer Level Packaging (DSBGA | WLCSP | WCSP | WLP)
CSPnl is a true wafer level package that can incorporate thin film redistribution films to route I/O pads to JEDEC / EIAJ standard pitches, and thereby, avoiding the need to redesign legacy parts for CSP applications.
ExposedPad LQFP / TQFP
This Amkor developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages.
ExposedPad SOIC / SSOP
This Amkor developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC and SSOP packages.
ExposedPad TSSOP
This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard TSSOP packages.
fcCSP (Flip Chip CSP)
Amkor Technology is now offering the Flip Chip CSP (fcCSP) package -- a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wire-bond interconnect.
FCmBGA (Flip Chip Molded Ball Grid Array)
FCmBGA provides additional benefits such as improved board real estate use, by allowing closer spacing between passives and the flip chip die, better warpage control for thin core substrates and improved solder joint reliability for passives.
Fine Pitch Copper Pillar Flip Chip
Copper pillar bump is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future ROHS requirements. It is an excellent interconnect choice for applications where some combination of fine pitch, ROHS / Green compliance, low cost and electromigration performance are required.
Flip Chip Packaging Technology Solutions
Demand for flip chip technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. SuperFC®, fcBGA, fcLBGA and fcCSP are qualified and are in production.
FlipStack® CSP
The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost.
FusionQuad® (VQFP / HVF-PQFP)
Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad QFP and MLF® technologies. FusionQuad® is based upon the addition of exposed bottom lands within a standard VQFP package format.
LQFP (Low Profile QFP)
Amkor offers a broad line of LQFP (QFP) IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness.
MCM-PBGA | MCM-BGA (Multi-Chip Module Plastic Ball Grid Array)
The MCM-PBGA (Multi-Chip Module Plastic Ball Grid Array) by Amkor incorporates the latest technology in high-density plastic IC packaging.
MEMS / MOEMS Packaging Technology Solutions
Amkor Technology is the world's leader in MEMS / MOEMs (Micro Electronic Packaging technologies) and the world's largest outsource provider of Micro-Electronic Machines (MEMS).
MicroLeadFrame® (MLF / QFN - Quad Flat No-Lead)
Amkor's MicroLeadFrame® (MLF / QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB.
MQFP (Metric QFP Package)
Amkor’s MQFP (Metric QFP) package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material and processes to assure successful, reliable performance of your IC chips. Having a complete line of MQFPs available and at your disposal means security, convenience and success.
MQFP PowerQuad 4
Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to solve these thermal problems.
Multi-Chip Package (MCP) | Stacked-Die Leadframe Package
Amkor's multi-chip package (MCP) and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor.
PBGA (Plastic Ball Grid Array)
Amkor's PBGAs (Plastic BGA) incorporate the most advanced assembly processes and designs for today's and tomorrow's cost / performance applications.
PDIP (Plastic Dual Inline Package) | SPDIP | DIP
Amkor is committed to continuing to service this long established standard industry package. The Amkor PDIP comes in a wide range of lead counts: from 8 - 48 leads with a lead pitch of 100 mils.
PLCC (Plastic Leaded Chip Carrier) | LCC Package
Amkor's PLCC offerings cover the total range offered by the industry. It includes all square body packages from 20 lead through 84 lead. Also included is the rectangular body format of the 32 lead. RoHs compliant, lead-free & green material sets are now our qualified standards.
PSOP (PowerSOP® 2 & 3 / PSSOP Package)
The Amkor-developed family of power IC PSOP (PowerSOP) packages significantly increases the thermal efficiency of power constrained standard SOIC packages.
Package on Package (PoP | PSfvBGA | PSfcCSP | TMV® PoP)
Amkor has expanded its comprehensive PoP (Package on Package) family and aligned the roadmap across the supply chain to ensure that PoP will continue to scale with the industry's miniaturization, higher density and performance enhancement requirements.
SOIC (Small Outline IC) Package
Amkor has a broad portfolio of Small Outline ICs (SOIC) packages, including .150”, .208” and .300” body sizes.
SOT-23 (Standard Outline Transistor) | SC-70 (Single Chip)
Amkor’s 1.0 mm thick, 3, 5, 6, and 8 lead SOT23 and 5 and 6 lead SC70 packages offer gullwing lead, sub-miniature, SMT performance characteristics.
SSOP (Shrink Small Outline Package) | MSOP (Micro SOP)
How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them. Shrink small-outline package (SSOP) is a microchip package for SMT and have "gull wing" leads protruding from the two long sides.
Stacked CSP (SCSP)
The Stacked CSP (SCSP) family utilizes Amkor's industry leading ChipArray® manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements.
SuperBGA®
The SuperBGA® (SBGA) technology provides a cavity down, high-power BGA package. SuperBGA®'s utilize advanced substrate designs with proven assembly practices and materials to assure your IC complementary performance.
SuperFC® (Super Flip Chip | FCBGA | Flip Chip BGA)
Amkor's SuperFC® (Flip Chip BGA) is the high performance flip chip solution. Flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding.
System in Package (SiP)
Amkor Technology is committed to being a leader in providing the services necessary to make our customers successful with System in Package technologies.
TEPBGA (Thermally Enhanced PBGA)
This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors (silicon).
TQFP
Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.
tsCSP (Thin Substrate CSP)
Amkor's tsCSP is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard outlines of the tsCSP package offer a broad selection of land pitch, count, and body sizes.
TSOP / WSOP
Amkor offers a full family of popular TSOP packages to serve the needs of IC designers, PCB / system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate reliably in a variety of environments.
TSSOP (Thin Shrink Small Outline Package)
With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin!