Global Thin Wafer Processing and Dicing Equipment Market: Industry Analysis and Forecast (2019-2026)

Priyani Gupta · May 28, 2025

The report on the impact of COVID-19 lockdowns on the revenue streams of market leaders, followers, and disruptors in the thin wafer processing and dicing equipment sector offers a comprehensive and insightful analysis, valuable for industry stakeholders navigating these uncertain times. The differential regional implementation of lockdown measures and their consequent varied economic effects rightly underline the necessity for tailored strategic responses by companies. This nuanced approach will indeed empower decision-makers to craft both short-term reactive plans and longer-term sustainable strategies by region—a highly practical outcome of this research.

The detailed market segmentation by wafer thickness, technology, and geography is well-articulated and provides a clear view of growth drivers such as the rising demand for 3D integrated circuits (3DIC) and miniaturization trends, particularly in applications like MEMS and RFID devices. The identification of Asia-Pacific as the dominant region, fueled by robust R&D investments and strong local players in China and Japan, resonates well with current global semiconductor supply chain dynamics. This geographic focus aligns with the broader reality that Asia-Pacific continues to be the manufacturing powerhouse for advanced electronics, despite the geopolitical challenges and supply chain vulnerabilities highlighted during the pandemic.

However, while the report provides rich market data and competitive analyses, it might be somewhat optimistic in downplaying the real-world challenges posed by the high capital expenditure and maintenance costs associated with thin wafer dicing equipment. The acknowledgment of these costs as a “hindrance” is accurate but perhaps understated. In reality, the steep upfront investments and ongoing operational expenses create substantial entry barriers, especially for smaller players and disruptors who might otherwise innovate aggressively in this space. This cost barrier risks consolidating market power further among established giants, potentially stifling disruptive innovation and competition—a controversial but necessary point for investors and policymakers to consider.

Moreover, the report’s methodology section invites readers to request a sample to understand the research process better, which is a good practice for transparency. Yet, in an age where open data and reproducibility are gaining prominence, providing more accessible methodological insights upfront could improve the report’s credibility and usability for a wider audience, including academic researchers and smaller firms with limited budgets.

The inclusion of strategic tools such as PEST, Porter’s Five Forces, and SWOT analyses adds considerable depth, equipping shareholders with a multi-dimensional framework to evaluate risks and opportunities. This holistic perspective is particularly important in a post-pandemic world where technological innovation must be balanced with geopolitical uncertainties and fluctuating supply chain stability.

In summary, this report serves as an essential resource for stakeholders in the thin wafer processing and dicing equipment market by distilling complex market dynamics into actionable intelligence. However, a more candid discussion around financial barriers and a stronger commitment to transparent methodology could further enhance its practical value. As the semiconductor industry grapples with rapid innovation cycles and pandemic-induced disruptions, such frankness will be crucial for fostering a competitive yet resilient ecosystem.

Dhruv Bindhani · Jun 25, 2025

akashy said:
Global Thin Wafer Processing and Dicing Equipment Market was valued US$ XX Mn in 2019 and is expected to reach US$ XX Mn by 2026, at CAGR of XX% during forecast period.

The report includes the analysis of impact of COVID-19 lock-down on the revenue of market leaders, followers, and disrupters. Since lock down was implemented differently in different regions and countries, impact of same is also different by regions and segments. The report has covered the current short term and long term impact on the market, same will help decision makers to prepare the outline for short term and long term strategies for companies by region.

To know about the Research Methodology :- Request Free Sample Report

A wafer is a thin slice of semiconductor material utilized in electronics. This material is used for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. Wafer dicing is the method by which individual silicon chips are separated from each other on the wafer.

Thin wafer dicing and processing equipment market size is expected to witness strong growth throughout the forecast period because three-dimensional integrated circuits across different end-use applications, such as portable consumer electronic devices, sensors, microelectromechanical systems (MEMS) and industrial products. Furthermore, the increasing demand for a three-dimensional integrated circuit (3DIC) is expected to add considerably to this growth over the forecast period. Nevertheless, the high cost associated with the purchasing and maintenance of thin wafer processing and dicing equipment may hinder the market in the forecast period.

Based on the wafer thickness, the 120?m segment is expected to grow at a high CAGR of XX% throughout the forecast period. An increasing trend of miniaturizing several RFID and power devices to obtain better functioning and improved electrical performance is responsible for the robust demand of processing and dicing equipment for wafers having a thickness of 120?m.

Geographically, Asia-Pacific analyzed to have the largest market share with XX% of the market throughout the forecast period. Additionally, the Asia-Pacific region is expected to dominate in coming years, thanks to major market players coupled with extensive R&D. Also, China and Japan is estimated to witness a stable growth in thin wafer processing and dicing equipment market size and is conserved to be an important competitor of the different manufacturer in the USA.

The objective of the report is to present a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, industry-validated market data and projections with a suitable set of assumptions and methodology. The report also helps in understanding global thin wafer processing and dicing equipment market dynamics, structure by identifying and analyzing the market segments and project the global market size. Further, the report also focuses on the competitive analysis of key players by product, price, financial position, product portfolio, growth strategies, and regional presence. The report also provides PEST analysis, PORTER’s analysis, and SWOT analysis to address the question of shareholders to prioritizing the efforts and investment in the near future to the emerging segment in global thin wafer processing and dicing equipment market.

for more info:Thin Wafer Processing and Dicing Equipment Market Size, Share, Trends and Forecast Analysis (2025-2032)

Scope of the Global Thin Wafer Processing and Dicing Equipment Market:Inquire before buying

Global Thin Wafer Processing and Dicing Equipment Market, By Application

• Logic and Memory

• MEMS (Micro Electro Mechanical Systems)

• Power Device

• RFID (Radio Frequency Identification)

• CMOS Image Sensor

Global Thin Wafer Processing and Dicing Equipment Market, By Dicing Technology

• Blade Dicing

• Laser Dicing

• Plasma Dicing

Global Thin Wafer Processing and Dicing Equipment Market, By Wafer Thickness

• 750?m

• 120?m

• 50?m

Global Thin Wafer Processing and Dicing Equipment Market, By Region

• North America

• Europe

• Asia Pacific

• Middle East and Africa

• South America

Key players operating in Global Thin Wafer Processing and Dicing Equipment Market

• EV Group

• Lam Research Corp.

• Plasma-Therm LLC

• DISCO Corp.

• Tokyo Electron Ltd.

• Advanced Dicing Technologies

• Suzhou Delphi Laser Co. Ltd.

• SPTS Technologies Ltd.

• Tokyo Seimitsu Co. Ltd.

• Panasonic Corp.

• Han's Laser Technology Co. Ltd

• ASM Laser Separation International (ALSI) B.V.

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The article from April 2, 2021, provides an overview of the Global Thin Wafer Processing and Dicing Equipment Market, offering insights into its market size, growth drivers, challenges, and regional dominance. It also briefly mentions the impact of the COVID-19 pandemic on the market.

Here's a detailed review of its key points:

1. Market Valuation and Forecast:

The Global Thin Wafer Processing and Dicing Equipment Market was valued at US$ XX Mn in 2019 and is projected to reach US$ XX Mn by 2026, growing at a CAGR of XX% during the forecast period. (Note: Specific values for XX Mn and CAGR are omitted in the provided text, but other search results indicate market values in the range of hundreds of millions to over a billion USD, with CAGRs typically above 6% for similar periods).

2. Impact of COVID-19:

The report aims to analyze the impact of COVID-19 lockdowns on market leaders, followers, and disruptors, recognizing that the impact varied by region and segment due to differing lockdown implementations. It provides insights for decision-makers to formulate short-term and long-term strategies.

3. What are Thin Wafers and Wafer Dicing?

Wafer: A thin slice of semiconductor material used for fabricating integrated circuits and in photovoltaics for solar cells.
Wafer Dicing: The process of separating individual silicon chips from each other on the wafer.

4. Market Drivers:

Increasing Demand for 3D Integrated Circuits (3DIC): This is a primary driver, fueled by various end-use applications.
Miniaturization: Growing demand for miniaturized electronic devices across different applications.
Key End-Use Applications: Portable consumer electronic devices, sensors, Microelectromechanical Systems (MEMS), and industrial products.

5. Market Restraints/Challenges:

High Cost: The significant cost associated with purchasing and maintaining thin wafer processing and dicing equipment may hinder market growth.

6. Segmentation by Wafer Thickness:

The 120µm segment is expected to exhibit high growth (CAGR of XX%) throughout the forecast period.
Reason for growth: The increasing trend of miniaturizing RFID and power devices to achieve better functioning and improved electrical performance drives the demand for equipment processing 120µm wafers.
Other mentioned thickness segments include 750µm and 50µm.

7. Regional Analysis:

Asia-Pacific is analyzed to hold the largest market share (XX%) and is expected to dominate in the coming years.
Reasons for Asia-Pacific's Dominance: Presence of major market players, extensive R&D activities.
Key Countries: China and Japan are expected to witness stable growth and are considered important competitors to manufacturers in the USA.

8. Report Objectives and Scope:

Objective: To provide a comprehensive assessment of the market with insights, facts, historical data, and projections.
Scope: Understanding market dynamics and structure by segmenting the market and projecting its size. It also covers competitive analysis of key players (product, price, financials, portfolio, strategies, regional presence) and includes PEST, PORTER's, and SWOT analyses.

9. Market Segmentation (as per report scope):

By Application: Logic and Memory, MEMS, Power Device, RFID, CMOS Image Sensor.
By Dicing Technology: Blade Dicing, Laser Dicing, Plasma Dicing.
By Wafer Thickness: 750µm, 120µm, 50µm.
By Region: North America, Europe, Asia Pacific, Middle East and Africa, South America.

10. Key Players Operating in the Market:

EV Group, Lam Research Corp., Plasma-Therm LLC, DISCO Corp., Tokyo Electron Ltd., Advanced Dicing Technologies, Suzhou Delphi Laser Co. Ltd., SPTS Technologies Ltd., Tokyo Seimitsu Co. Ltd., Panasonic Corp., Han's Laser Technology Co. Ltd, ASM Laser Separation International (ALSI) B.V.

Global Thin Wafer Processing and Dicing Equipment Market: Industry Analysis and Forecast (2019-2026)

Priyani Gupta

Member

Dhruv Bindhani

Active member