The semiconductor industry belongs to the electronic information industry and belongs to the hardware industry. An industry developed based on semiconductors is the foundation of the information age.
At the top of the semiconductor industry are IC design companies and silicon wafer manufacturing companies. IC design companies design circuit diagrams according to customer needs. Silicon wafer manufacturing companies use polysilicon as raw materials to produce silicon wafers. The main task of the midstream IC manufacturing company is to transplant the circuit diagrams designed by the IC design company to the wafers manufactured by the silicon wafer manufacturing company. The completed wafer is then sent to the downstream IC packaging and testing factory for packaging and testing.
1, silicon wafer manufacturing
The most upstream of the semiconductor industry is silicon wafer manufacturing. In fact, the upstream silicon wafer industry is formed by three sub-industries, which are the initial purification of silicon ? manufacturing of polysilicon ? manufacturing of silicon wafers.
2, IC design
The silicon wafer manufacturing mentioned earlier, the input is quartz sand, and the output is silicon wafer. The input of IC design is the super brain power (and liver) of the "good people", the output is the circuit diagram, and finally a mask is sent to the IC manufacturing company, and the merits are complete!
3, IC manufacturing: transfer the circuit diagram on the photomask to the wafer
IC manufacturing process is more complicated, and the process is similar to the traditional photo manufacturing process. The main steps include: thin film ? photolithography ? development ? etching ? photoresist removal. Thin film preparation: several layers of thin films of different materials and thicknesses are grown on the surface of the wafer; photolithography: the pattern on the mask is copied to the silicon wafer. The cost of photolithography is about 1/3 of the entire silicon wafer manufacturing process, and the time consumed is about 40-60% of the entire silicon wafer process;
4, IC packaging and testing: packaging and testing
The packaging process is roughly as follows: cutting ? adhesion ? cutting welding ? molding. Cutting: cut the wafer produced by IC manufacturing company into rectangular IC; sticking: sticking the IC to the PCB; welding: soldering the pins of the IC to the PCB to make it compatible with the PCB; The pins are moulded;
Company inventory of semiconductor industry
1, Intel Corporation
2, Samsung Electronics
3, Texas Instruments
4. Toshiba
5. TSMC
Click to read top ten semiconductor companies.
At the top of the semiconductor industry are IC design companies and silicon wafer manufacturing companies. IC design companies design circuit diagrams according to customer needs. Silicon wafer manufacturing companies use polysilicon as raw materials to produce silicon wafers. The main task of the midstream IC manufacturing company is to transplant the circuit diagrams designed by the IC design company to the wafers manufactured by the silicon wafer manufacturing company. The completed wafer is then sent to the downstream IC packaging and testing factory for packaging and testing.
1, silicon wafer manufacturing
The most upstream of the semiconductor industry is silicon wafer manufacturing. In fact, the upstream silicon wafer industry is formed by three sub-industries, which are the initial purification of silicon ? manufacturing of polysilicon ? manufacturing of silicon wafers.
2, IC design
The silicon wafer manufacturing mentioned earlier, the input is quartz sand, and the output is silicon wafer. The input of IC design is the super brain power (and liver) of the "good people", the output is the circuit diagram, and finally a mask is sent to the IC manufacturing company, and the merits are complete!
3, IC manufacturing: transfer the circuit diagram on the photomask to the wafer
IC manufacturing process is more complicated, and the process is similar to the traditional photo manufacturing process. The main steps include: thin film ? photolithography ? development ? etching ? photoresist removal. Thin film preparation: several layers of thin films of different materials and thicknesses are grown on the surface of the wafer; photolithography: the pattern on the mask is copied to the silicon wafer. The cost of photolithography is about 1/3 of the entire silicon wafer manufacturing process, and the time consumed is about 40-60% of the entire silicon wafer process;
4, IC packaging and testing: packaging and testing
The packaging process is roughly as follows: cutting ? adhesion ? cutting welding ? molding. Cutting: cut the wafer produced by IC manufacturing company into rectangular IC; sticking: sticking the IC to the PCB; welding: soldering the pins of the IC to the PCB to make it compatible with the PCB; The pins are moulded;
Company inventory of semiconductor industry
1, Intel Corporation
2, Samsung Electronics
3, Texas Instruments
4. Toshiba
5. TSMC
Click to read top ten semiconductor companies.